| Mfg Part Number: PAL10H8-2MJ883B | Alternate P/N: PAL10H82MJ883B | Manufacturer: Mmi Amd |
| NSN : 5962-01-295-8583 | NIIN : 012958583 | Item Name : microcircuit memory |
| CAGE Code : 50364 | FSC : 5962 Microcircuits Electronic |
Thank you for choosing NSN Part PAL10H8-2MJ883B of Hardware and Fasteners for all your operational needs. You have reached our NSN RFQ page which features all of our highly sought-after NSN 5962-01-295-8583 parts and components with Microcircuit Memory, manufactured by MFG Mmi Amd. Some of these items include part PAL10H8-2MJ883B, and various others, all of which have been vetted for quality assurance and authenticity. At Hardware and Fasteners, we are committed to providing customers quality items that have been sourced from leading manufacturers across the globe. If you find yourself in need of quality parts and components, you have come to the right place.
PAL10H8-2MJ883B part of NSN 5962-01-295-8583 products that we feature by MFG Mmi Amd are paired alongside CAGE Code 50364. Hardware and Fasteners uses CAGE Codes, allowing our customers to narrow down our vast catalogs with ease. When you find an item that works for your operations, fill out and submit an RFQ form for your comparisons. As you complete the form, please include target prices, desired quantities, and expected shipping time frames. Within 15 minutes of completion, an account manager will draft a sourcing solution that keeps your unique requirements in mind. Alternatively, you can call or email us directly; we are available 24/7x365!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-295-8583 Item Description: Microcircuit Memory | 5962 | 012958583 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Pal10h8-2mj883b | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.000 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.307 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.200 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
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